新世代顯示器用耐衝擊 Window film

Window Film of Impact Resistance for Next-generation Display

工業技術研究院

Industrial Technology Research Institute

材化所

以軟克剛的新世代軟性透明顯示模組

Overcoming hardness with softness - Next-generation soft transparent display module

為使透明顯示互動系統於戶外智慧場域使用時，面板能承受觸碰或撞擊，軟性透明顯示模組藉由高阻尼與高剛性兩種不同特性的材料，達到應力支撐和分散效果，並於最外層整合透明硬質塗層材料，防刮、耐磨、耐撞擊，提升整體顯示器之環境耐受性與操作可靠度。

For outdoor smart site applications, to make the panels of transparent display interaction systems withstand contact and impact, the soft transparent display module combines a high damping material with a high rigidity material to provide stress support and dispersion. A transparent hard coating material is also applied on the outermost layer to provide scratch resistance, abrasion resistance, and impact resistance, enhancing the overall endurance in environments and operation reliability of the display.

・防刮、耐磨、耐撞擊
・高阻尼與高剛性兼具
・達到支撐和分散效果

・Scratch resistance, abrasion resistance, and impact resistance
・Provides both high damping and high rigidity
・Achieves support and dispersion

複合式熱像安全防護解決方案

Smart Thermal Image Body Temperature Detection System

工業技術研究院

Industrial Technology Research Institute

微系統中心

超級電眼！守護防疫第一線

The first line of pandemic defense with super electric eyes

運用非接觸式探測紅外線能量，進行多人動態體溫量測並導入隱私照護應用。 以AI技術精準量測臉部額頭區域，克服熱源干擾並導入智慧化溫度補償校正，具AI辨識、室內外皆宜、多人動態測量與快速布建四大特點，目前已應用於臺灣北部及離島澎湖國高中小學。

This technology utilizes non-contact infrared detection to conduct multiple people dynamic body temperature measurements for private care applications. This technology uses AI to measure the forehead region accurately and overcome the interference of heat sources. It also introduces smart temperature compensation adjustments. The technology has four main features, including AI recognition, indoor and outdoor adaptability, multiple people dynamic measurements, and easy deployment. It's currently implemented in elementary and middle schools in Northern Taiwan and Penghu.

・AI臉部局部辨識
・室內外溫度補償
・多人動態測量

・AI partial face recognition
・Indoor/outdoor temperature compensation
・Multiple people dynamic measurement

異質整合技術-micro-LED in cell感測整合技術

In-cell Optical Biosensors Based on Flexible and Active Driving micro-LED Display Platform

工業技術研究院

Industrial Technology Research Institute

電光系統所

小螢幕大突破！全螢幕多指紋辨識

Small Screen, Big Step - Full-screen multi-fingerprint recognition

生物辨識已普及於各式穿戴裝置，並持續朝全螢幕、多指安全指紋辨識技術發展。本技術首創兼具顯示與感測的µLED創新科技，將生物感測裝置與顯示器異質整合於同一基板上、薄化模組，打造領先業界全屏整合指紋辨識、觸控與µLED顯示的互動顯示技術，可滿足行動/穿戴資安需求。

Biometrics has been widely applied on various wearable devices and is developing toward full-screen, multi-finger secure fingerprint recognition. This technology is the first innovation of µLED, which provides both lighting and sensing that integrates bio-sensing devices and displays onto the same substrate and achieves thinner modules. This technique is the first interactive display technology in the industry to attain full-screen integration of fingerprint recognition, touch control, and µLED display. It meets the requirements for the information security of mobile and wearable devices.

・生物辨識
・微型化發光二極體
・內嵌式感測

・Biometrics
・Miniaturized LED
・Embedded sensing

超低繞射透明顯示技術

Low-Diffraction Transparent Display

工業技術研究院

Industrial Technology Research Institute

電光系統所

提供高清晰影像與虛實整合的智慧窗

Cyber-physical Smart window providing high-resolution images

透明顯示虛實資訊融合與互動技術可結合本技術，於透明智慧窗上提供乘客即時取得想要的清晰景物導覽，同時降低乘客觀看移動物體背景影像資訊模糊所產生的人眼不適感。。未來提供面板、感測模組廠、及車用顯示器廠商發展智慧移動、智慧醫療場域等相關應用。

The transparent virtual-real information superimposition and interactive technology could combine this technology to provide passengers with clear real-time guides on transparent smart windows. They also mitigate passengers' illnesses caused by viewing blurry background image information of viewing objects.

・降低透明顯示器繞射現象
・提升顯示器背景影像清晰度
・可維持顯示器高透明度

・Reduce the diffraction of transparent displays
・Improve the background image clarity of the monitor
・Maintains the high transparency of the display

LED感測陣列用於眼追蹤系統

Micro Sensor Array Eye-tracking Glass

工業技術研究院

Industrial Technology Research Institute

電光系統所

下世代智慧眼鏡−微感測陣列感知鏡片

Next-generation smart glasses- Sensing lens with microsensor array

AI特徵式辨識驅動之微感測陣列技術，有別於傳統眼追蹤技術以相機作為眼動追蹤載具，克服現有技術在穿戴應用上之體積大、隱私權問題、不易與光學鏡片整合、效能功耗比低、缺乏友善互動模式等瓶頸，能偵測視線，使用視線行為並結合控制反應，提供最便利的人機互動方式。

Conventional eye-tracking technologies utilize cameras for eye tracking. Unlike those approaches, the microsensor array technology driven by AI feature detection broke through current limitations, including its large size, privacy issues, integration difficulty with optical lens, low performance per watt, the lack of friendly interactive modes, etc. The technology detects gazes and combines gaze motions with control reactions to provide the most convenient human-machine interaction.

・微型薄膜化感知鏡片
・非成像視線追蹤
・高速低功耗頭戴裝置

・Miniature thin film sensing lens
・Non-imaging gaze tracking
・High speed and low power consumption headset

高精密陣列之全彩micro-LED顯示元件技術

High-resolution Full-color micro-LED Display

工業技術研究院

Industrial Technology Research Institute

電光系統所

高解析全彩micro-LED

High-PPI Full-color micro-LED

高精密陣列之全彩micro-LED顯示元件技術，未來可整合微型感測器，提供消費者最佳的感知融合體驗。透過QD圖案化技術實現高解析高效率之顯示功能，其紅/綠量子點圖案化尺寸達 5 μm，領先國際技術指標 (20 μm)。

The high-PPI full-color micro-LED display technology integrates micro-LED array, active driving backplane and QD technologies. It could combine with heterogeneous integration technologies such as micro-sensor and micro IC and provides customers. With the QD patterning technology, it achieves high-resolution, high-efficiency display functions with a 5 μm red/green quantum dot pattern size, which surpasses international standards (20 μm).

・量子點光色轉換
・micro-LED主動驅動
・高解析度顯示模組

・Quantum dot light-color conversion
・micro-LED active driving
・High-resolution display module

整合主被動元件之面板級封裝RDL中介層技術

Panel Level Fan-out RDL with Integrated Active/Passive Device Technology

工業技術研究院

Industrial Technology Research Institute

電光系統所

少量多樣客製化面板級系統封裝

Small-volume large-variety customized panel-level system packaging

以既有薄膜元件製程為基礎，整合高深寬比導線技術、高角度導通孔技術與RDL(Redistribution Layer)重分佈製程，開創功能化RDL中介層(Functional RDL)，可跨領域應用於PCB 產業的IC載板與RDL技術整合，提高產品效能與生產效益。

Based on the existing thin-film component processes, this technology integrates high-aspect-ratio wire technology, high-angle via hole technology, and the Redistribution Layer (RDL) process to create the functional RDL. It allows the cross-domain application of the integration of IC carrier boards in the PCD industry and RDL technology to improve product performance and production benefits.

・產品輕薄化
・提高產品效能
・提升整合晶片功能

・Thinner product
・Improved product performance
・Enhanced integrated chip function

FMCW光達晶片與訊號驅控分析模組

Chip Scale of FMCW LiDAR and Photoelectric Drive Control Module

工業技術研究院

Industrial Technology Research Institute

電光系統所

體積縮小700倍−下世代抗干擾光達技術

700 times smaller -Next generation anti-jamming LiDAR technology

FMCW光達晶片為全固態設計，具輕、薄、小、便宜等優勢。積體化設計與震鏡掃描模組相較，總體積可縮小約700倍。 相較ToF技術，FMCW技術可以同時偵測外界移動物體速度，輔助自駕車判斷，減少緊急時刻運算處理資料量，縮短反應時間一半以上，更適合自駕車應用。

FMCW LiDAR chips adopt an all-solid-state design that is light, thin, small, and inexpensive. In comparison with Galvo scanning modules, the integrated design can be 700 times smaller in size. In comparison with the ToF technology, FMCW simultaneously detects the speed of moving objects to assist the decision-making of self-driving vehicles. By reducing the computing data volume during emergencies, it shortens the reaction time by over 50%. It is more suitable for self-driving vehicle applications.

・大幅提升訊號解析能力
・反應時間縮短1/2
・體積縮小700倍

・Greatly improved signal analysis capabilities
・Reaction time shortened by 1/2
・700 times smaller in size

全球首創 超薄 微型QD LED

Ultra Thin Light QD LED backlight

隆達電子股份有限公司

Lextar Electronics Corporation

全球首創U-Light微型封裝技術

The world's first U-Light micro packaging technology

全球唯一的Ultra Thin Light QD LED 微型封裝技術，可直接導入既有LCD產業、色彩表現優異、無尺寸限制、薄型化等優勢。 帶動台灣顯示器產業技術轉型，搶先建構新的專利布局，讓整個台灣顯示器產業由A向A+大幅邁進。

The globally unique "Ultra Thin Light QD LED" micro packaging technique can be directly applied to existing LCD industries to provide excellent color performance and thinness without size limitations. This technology will spur the technological transformation of Taiwanese display industries and lead up the foundation of a new patent portfolio to improve Taiwanese display industries from A to A+ by leaps and bounds.

・全球首創超薄微型QD LED
・背光模組厚度小於10mm
・超廣色域(Rec. 2020 >90%)

・The world's first Ultra-thin micro QD LED
・Backlight module thickness< 10mm
・Super wide color gamut (Rec. 2020 >90%)

電漿拋光機

Plasma Polish Chamber

天虹科技股份有限公司

SKY TECH INC.

低元件損傷且廣用之電漿拋光/蝕刻設備

Plasma polishing/etching equipment with low component damage and wide application

電漿拋光技術應用於SiC晶圓製備預計可取代傳統化學機械平坦化製程，達到高良率的SiC晶片生產。提供 SiC晶片製造商低製程費用、高產能且環保的製程技術。 亦可應用於電漿乾式蝕刻製程, 並且搭配中性電漿束進行蝕刻, 達到溫和蝕刻、降低對元件損傷之目的。

The application of plasma polishing technology to SiC wafer preparation is expected to replace the traditional chemical-mechanical planarization process and achieve high yield SiC wafer production. Provide SiC wafer manufacturers with low cost, high-productivity, and environmentally friendly process. It can also be applied to the plasma dry etching process, and is etched with a neutral plasma beam to achieve gentle etching and low device damage purpose.

1.特殊的氣體擴散板具有離子過濾功能。
2.載盤連接射頻發生器形成偏壓功率。
3.搭載 6種反應氣體可支援多種電漿製程。

1. Special gas diffusion plate with ion filtration function.
2. The chuck is connected to the RF generator to form a bias power.
3. Equipped with 6 kinds of reaction gases, it can support a variety of plasma processes.

行動智慧視窗

Most Light-weighted Mobile Smart Sport Lens

工業技術研究院

Industrial Technology Research Institute

電光系統所

立博光電

Lipro Vision

微型發光二極體 透明軟性基板 超穎光學

Micro LED transparent and flexible subtract optics

奈米級超穎光學與內嵌micro IC透明micro LED顯示一體化設計。在B2C市場解決戶外使用時看不清、美感差、笨重等問題.在B2B市場解決光機效能不佳或無智能裝置問題。 本產品重量不到50g; micro IC比TFT亮10倍以上;透明micro LED比micro OLED 或 LCOS 顯示器影像更擬真。

This product integrates nano-level super-optics, embedded micro IC and transparent micro LED display. In the B2C market, it addresses user experience challenges of unclearness, poor aesthetics and heavy weights when used outdoors. For B2B, it solves the problem of poor optical-mechanical performance or lack of smart devices. The super-optical smart glasses weigh less than 50g. The micro IC is over 10 times brighter than TFT. The transparent micro LED makes images look more authentic than micro OLED or LCOS displays. .

1. 戶外活動顯示最清晰
2. 穿戴功能時尚都兼具
3. 運動休閒娛樂都適宜

1.Clear images for outdoor displays
2. Wearable and Fashionable
3. Good for sports and leisure

我視AI魚缸

AI Aquarium

工業技術研究院

Industrial Technology Research Institute

電光系統所

一眼秒懂

The information will be displayed wherever you look.

AI Aquarium 提供無接觸的人機互動，並解決導覽員短缺的問題，可幫助遊客即時辨識不同的海洋生物。 藉由直覺式的透明虛實融合互動顯示技術，系統可以辨識海洋物種，並根據遊客的視線在透明顯示器上顯示相對應的魚類資訊。

AI Aquarium provides contactless human-computer interaction and solves the problem of a shortage of tour guides, that helps visitors identify the different marine creatures in real time. Using intuitive virtual-real fusion, the system can recognize aquatic species and show corresponding information on a transparent display according to the visitor’s line of sight.

動態虛實融合-直覺式擴增實境互動導覽。
生物識別-即時識別動態魚類。
眼球追蹤-即使戴口罩也能追蹤使用者視線。
手勢操作-零接觸互動，開啟並獲取相關資訊。

Dynamic virtual-real fusion – Intuitive augmented reality interactive guidance.
Object recognition – Real-time identification of dynamic fish.
Eye tracking – Track user's line of sight while wearing masks.
Gesture-based operation – Zero-touch interaction to access relevant information.

深度學習編譯器與程式庫技術動態平行編譯與執行

Neural Network Compiler for Parallel and Heterogeneous Inference on Multiple AI Accelerators

工業技術研究院

Industrial Technology Research Institute

電光系統所

為AI晶片提供AI模型編譯技術，高效執行深度學習運算

Provide the AI compilation techniques and parallel/heterogeneous runtime for AI SoC Vendors.

AI需要運用複雜的運算，「效能」與「能耗」成為企業亟需解決的兩大問題，因此衍生出DSP、GPU、NPU及ASIC 等異質運算架構。工研院動態平行編譯與執行技術，將不同運算工作交由符合需求的專用處理器執行，能大幅提升運算效能並改善能源使用效率

Deep Learning uses a complex structure of algorithms to run on AI hardware. Performance and Efficency are the major issues that need to be solved when enterprises introdece AI applications. The heterogeneous processor integrates DSP, GPU, NPU or ASIC into a heterogeneous AI SoC that provides cost-effective solution for AI application. ITRI develops dynamic parallel AI compiler and runtime techniques to compile AI model and run AI operators in parallel on heterogeneous chips. This approach can improve computing performance and improve energy efficiency.

・支援異質架構晶片(CPU、DSP、GPU、NPU)之深度學習排程優化技術
・可針對異質架構晶片進行動態平行編譯與運算優化
・配合動態分配執行環境，提升運算之效能

・Provide the schedule optimization mechanisms for the heterogeneous AI SoC.
・Provide dynamic parallel compilation and runtime software environment for heterogeneous AI SoC.
・Provide dynamic load balance runtime to improve computing performance

4D拼圖可程式封裝平台

Puzzle Programmable Packaging Platform

工業技術研究院

Industrial Technology Research Institute

電光系統所

解決SiP系統設計複雜耗時，縮短新產品上市時間

A solution to AIoT SiP design with fast proto-typing and shorten time to market.

解決少量生產良率低及多樣客製化產品開發費用高等各項挑戰，進行建置預置型封裝基板公版，有效縮短設計開發及製程時程(時程≧50%)，並具備可彈性擴充設計模組化，以因應不同場域客製需求(如：智慧醫療、智慧工廠…等)

To solve various challenges such as low production yield and high development cost of various customized products, build a prefabriated universal substrate, effectively shorten the design and manufacturing process time (shroten time ≧ 50%), and have the ability to flexible expansion design and modularization to meet customized needs in different fields (such as: smart medical care, smart factory...etc.)

・少量多樣生產彈性設計
・快速雛形驗證
・可拼接彈性擴充設計

・Best for high-mix low-volume production
・Fast prototyping verification
・Puzzle scalability design

基於CIM運算核心之Speaker ID

SpeakerID Recognize Base on Computing in Memory Technology

工業技術研究院

Industrial Technology Research Institute

電光系統所

超低功耗,超高能效記憶體內AI運算

Ultra-low power and High performance AI chip

現今的處理器晶片多採用馮紐曼架構，然而這不僅限制了AI晶片的運算能效，也讓AI由雲端走向裝置端的實現變得困難，因此尋找可以突破馮紐曼架構障礙的新興架構，成為發展裝置端AI的關鍵。

To overcome the von Neumann bottleneck, ITRI's ultra-low power and high computing performance CIM macro is the solution for edge AI computation.

・低功耗
・高效能
・記憶體內運算

・Ultra low power
・High performance
・Computing in memory

碳化矽伺服電機驅控系統

SiC Servo Motor Control Reference System

工業技術研究院

Industrial Technology Research Institute

電光系統所

國內首創高功率密度、高效節能SiC伺服方案

The first domestic high-power density and high-efficiency SiC servo solution.

結合自主SiC PIM模組及關鍵半導體晶片，開發12 kW伺服電機驅控器公版暨驗證平台，功率密度提升3.6倍，重量降低50%，效率最高提升7%，為國內首創高精度、高功率密度、高效節能SiC伺服方案。

By combining self-developed SiC PIM modules and critical semiconductor chips, we have developed a 12 kW servo motor control platform for public use and verification. This platform achieves a 3.6-fold increase in power density, a 50% reduction in weight, and a maximum efficiency improvement of 7%. It represents the first high-precision, high-power density, and high-efficiency SiC servo solution in the domestic market.

・功率密度提升3.6倍
・國產自主SiC關鍵組件
・高效節能伺服驅控公版

・Power density increased by 3.6 times
・Domestic self-developed key SiC components.
・High-efficiency and energy-saving servo drive control platform.

多工AI視覺可重組嵌入式異質系統設計

Design of Multi-task AI Vision Reconfigurable Embedded Heterogeneous System

工業技術研究院

Industrial Technology Research Institute

電光系統所

滿足產業界同時執行多工視覺AI的需求

Meeting the industry's demand for simultaneous multi-tasking visual AI.

系統設計針對Embedded FPGA平台，運用雙頻多協議BLE+Flash扇出型封裝晶片堆疊技術和Shuttle服務流程，並以可重組內部記憶體架構降低外部記憶體存取頻寬，優化系統效能。同時整合時下的深度學習演算法，以模組化設計新增客製化AI演算法。

The system design utilizes dual-frequency multi-protocol BLE+Flash fan-out package stacking and the Shuttle Service Flow of Chiplet Integration for the Embedded FPGA Platform. The software design employs a reconfigurable internal memory architecture to reduce external memory access bandwidth and achieve optimal system performance. Additionally, it integrates cutting-edge deep learning algorithms and provides modularization for the inclusion of customized AI algorithms.

・雙頻BLE+Flash晶片堆疊技術
・可重組內部記憶體架構設計
・深度學習演算法模組化整合

・Dual-frequency BLE+Flash chip stacking
・Reconfigurable internal memory architecture design
・Modular integration of deep learning algorithms

HPC 超高發熱晶片之散熱方案

Thermal Solution for HPC Chip Cooling

工業技術研究院

Industrial Technology Research Institute

電光系統所

持續超越的 HPC 散熱方案

Continuously Surpassing: HPC's Cooling Solution

利用高均溫的 TGP Lid 元件，並將該元件技術導入高冷卻性能的浸沒式冷卻系統，嘗試解決 1KW 以上的高散熱需求，提供業界具備高散熱與高能源使用效率的最適化落地方案，可為AI 研究、科學模擬和數據分析...等強烈依賴 HPC各行業帶來巨大潛力。

High heat spreading performance of TGP Lid components and integrating this technology into a high-performance immersion cooling system, we strive to address the high heat dissipation demands exceeding 1KW. Our optimized solution provides the industry with high thermal performance and energy efficiency, offering immense potential for various sectors heavily reliant on HPC, such as AI research, scientific simulations, and data analysis.

* 精密加工技術
* 表面的散熱增強改質
* 具落地性技術開發

* Precision machining technology
* Surface heat dissipation enhancement modification
* Mass production technology development

非皮膚接觸式生理感測技術

Non-skin Contact Physiological Sensing Technology

工業技術研究院

Industrial Technology Research Institute

電光系統所

無感穿戴，常態性感測

Non-inductive wear, normal sense detection

非皮膚接觸式肌力感測臂帶、肌力感測智慧褲及ECG感測方向盤，採用軟性非接觸皮膚生理感測技術，可隔織物量測肌電訊號，來提供無感穿戴感測之便利性，可應用於科學化運動訓練、健身、長照，另可隔著織物或皮革，量測心電訊號，可應用於智慧座艙之駕駛生理感知。

The non-skin contact muscle strength sensing armband, muscle strength sensing smart pants and ECG sensing steering wheel can be applied to scientific sports training, fitness, the elderly long-term care and the driver’s physiological perception for the smart cockpit by using soft non- skin contact physiological sensing technology to measure myoelectric signals through fabrics to provide the easy-wearing sensing.

・非皮膚接觸式感測
・動態下，精準感測
・容易與車內裝整合

・Non-Skin Contact Sensing
・accurate sensing in moving
・Easy to integrate with car interior

高清晰透明投影膜

High-clarity Transparency Projection Film

工業技術研究院

High-clarity Transparency Projection Film

電光系統所

可投影的透明玻璃

projectable transparent glass

(1) 透明投影顯示模組提供高背景清晰度和短焦投影功能，解決了傳統投影技術的矛盾。客戶可享受優質投影體驗和服務。 (2) 次微米結構設計，提升投影品質並維持背景透明度。具備差異化價值，市場競爭力強。

(1) The transparent projection display module provides high background clarity and short-throw projection capability, resolving the contradictions in traditional projection technology. Customers can enjoy superior projection experience and services. (2) The sub-micron structure design enhances projection quality while maintaining background transparency. It possesses distinctive value and strong competitiveness in the market.

技術獨特性：多層光學結構，兼顧背景透明度和投影品質。
應用情境：智慧育樂、智慧移動、智慧零售等場域。
市場價值：提供差異化投影解決方案，推動相關產業發展。

Technological uniqueness：Multiple optical layers for clear backgrounds and quality projections.

Application scenarios: Smart education, mobility, and retail environments.

Market value:Offering differentiated projection solutions, driving industry development.

即時高擬真3D互動系統

Hyper-realistic 3D Interactive System

工業技術研究院

Industrial Technology Research Institute

電光系統所

即時高擬真3D互動系統-生成式AI 3D模型

Hyper-realistic 3D Interactive System - AI Generated 3D Models

即時高擬真3D互動系統內建「裸視3D顯示器校正技術」、「裸視3D顯示技術」、「2D轉3D成像技術」、「肢體辨識互動技術」，快速建立虛擬3D替身，且無須透過穿戴式裝置可讓多人同時看見3D影像。

Hyper-realistic 3D interactive system has built-in "Hyper-realistic 3D Display correction technology", "Hyper-realistic 3D display technology", "2D to 3D imaging technology", and "Body recognition and interaction technology" to quickly create virtual 3D avatars without going through wearable devices and let multiple people to see 3D images at the same time.

・AI智慧去背分析
・2D影像即時3D視覺錯視
・智能化即時3D虛實影像融合

・AI Background Subtraction
・3D Anamorphic Illusion
・3D virtual and real images fusion in real-time

多目標多相機追蹤技術

Multi-object Multi-camera Tracking

工業技術研究院

Industrial Technology Research Institute

電光系統所

智能監控，精準識別，跨相匹配全方位

Intelligent surveillance, precise identification, comprehensive cross-camera matching

本技術旨在解決現實交通場景中搜索和追踪特定車輛的難題。透過主成分分析和獨立成分分析技術，並結合本技術所提出之評分方法，可有效抵抗雜訊干擾，同時改善跨相機物件匹配準確度。相比現有技術，可在相同準確度下，減少85%模型參數量，並具有更高的穩定性和商業潛力。

This technology aims to solve the problem of tracking specific vehicles in real traffic scenarios. By leveraging PCA and ICA techniques, combined with the proposed scoring method, it can effectively resist noise interference and improve the accuracy of cross-camera object matching. Compared to existing techniques, it can reduce the amount of model parameters by 85% while maintaining the same accuracy, thereby demonstrating higher stability and commercial potential.

・高準度跨相機物件追蹤
・低運算量物件特徵萃取

・High accuracy cross-camera object tracking
・Low computational cost object feature extraction

觀光遊船智慧窗屏導覽系統

Smart Tour Guide Window for Cruise

工業技術研究院

Industrial Technology Research Institute

電光系統所

可提供旅客即時、多元之港灣景點與城市導覽資訊服務

The system provides tourists real-time city and harbor tour guide information services

為解決遊客無法即時獲得所需景點資訊之現行觀光導覽方式，以透明顯示器技術為基礎，開發觀光遊船窗屏導覽系統，此系統可依乘客觀看方向，在透明窗屏相對位置顯示出後方景物的資訊，其可辨識旅客朝向角度 40度(半側臉)，辨識位置正確率≧90%@ 5~10 節模擬船速。未來可以應用在船舶、智慧移動及其他觀光場域。

The system enables the cruise tourists to derive real time tour guide service through transparent display technology. The smart windows can display the information of the attractions that the tourists are watching, and the tourist orientation that the system can recognize reaches 40 degrees(half face). Additionally, image-assisted positioning is used to correct the object position (positioning accuracy≧90% @ 5~10 knots). In the future, it can be applied to tour, cruise, smart vehicles and other tourism fields.

・直覺式擴增實境互動
・跨屏幕資訊顯示
・即時景點與商情資訊

・An intuitive AR interaction technology
・Cross-screen information interaction
・Realtime attractions and business information

All-in-One熱影像安護技術

All-in-One Thermal Sensing System

工業技術研究院

Industrial Technology Research Institute

感測系統中心

「All-in-One熱影像安護技術」對生理資訊和患者活動的非接觸感測，滿足世界對於後疫情智能醫療的需求。熱圖像處理具有隱私保護功能，偵測體溫、心率和呼吸率，離床、跌倒和久坐的監控，為遠程醫療服務提供經濟高效的解決方案。

All-in-One Thermal Sensing System"provides high-precision remote detection of vital signs and patient activities. To meet post-epidemic non-contact smart medical care. Thermal image processing with privacy-preserving capabilities, detection of body temperature, heart rate, and respiration rate for multiple objects, monitoring of getting out of bed, falling, and sedentary, alerting when abnormality is detected, providing a cost-effective solution for telehealth services.

1. 行為的精確識別
2. 溫度誤差<0.3±°C
3. 多參數生理監測

1. Accurate recognition of atient behavior
2. Temperature detection error <0.3±°C.
3. Multiple vital sign monitoring

祈福許願樹

Wishing Tree

工業技術研究院

Industrial Technology Research Institute

電光系統所

透過即時線上傳輸軟體的功能，可以提供全世界各地的人，以遠端連線的方式，將每一個人的祈福心願即時呈現在展品上，把祝福的心願傳遞出來。

Wishing tree provides people using social media, e.g. line, via internet remote connections to present blessing wishes.

・裸眼3D顯示
・即時肢體辨識與互動
・祈福訊息遠端傳輸與呈現

・nakes eye 3D display
・real time pose detection and interactive
・blessing wishes remote transmition and present

全球領先無光罩適應形圖案化補償技術

Maskless DLT for RDL Dynamic Die Shift Correction

工業技術研究院

Industrial Technology Research Institute

電光系統所

面板級無光罩適應形圖案化補償技術，可補償晶片因模封製程而衍生的位移缺陷，其導線層串接動態補償之能力可達 XY位移: 50 μm、θ位移: 0.3o，此技術可用於高效能伺服器之多晶片封裝。

ITRI has developed maskless technology for RDL Dynamic Die Shift Correction (DDC) to meet the diverse requirements of high-end panel-level fan-out packaging. The pattern compensation from die shift has been achieved XY: 50μm & θ: 0.3o by using Digital Lithography Technology (DLT) for panel-level packaging production.

・面板級大面積製程
・無需實體光罩
・可用於多晶片封裝

・Panel Level Process
・No Mask Required
・Be Used for Multi-die IC Packaging

全球領先無光罩高深寬比曝光及高填孔濺鍍技術與應用

High Aspect Ratio Digital Lithography & High Taper Angle Sputtering Technologies

工業技術研究院

Industrial Technology Research Institute

電光系統所

以無光罩高深寬比曝光(AR:3)及高填孔濺鍍(85o)技術為基礎，在面板級封裝細線路上進行薄膜被動元件整合，使薄膜被動元件尺寸微縮，有助於5G無線通訊之封裝晶片朝薄型化產品發展。

ITRI has developed high aspect ratio (AR:3) digital lithography and high taper angle (85o) sputtering technologies for high-end fan-out panel level RDL applications such as a bandpass filter integrated in redistribution layers (RDLs). And it achieves in a thinner stacking structure thickness that can be used as an optimal solution to minimize the 5G system module.

・面板級無光罩製程
・高深寬比圖案化
・高角度填孔濺鍍

・Panel Level Process without mask
・High Aspect Ratio Patterning
・High Taper Angle Sputtering

全球首創低繞射透明AM Micro LED

Low Diffraction of Transparent AM Micro LED

工業技術研究院

Industrial Technology Research Institute

電光系統所

因應未來智慧生活場域產品之應用，工研院以透明顯示整合技術為基礎，開發低繞射透明顯示技術，可大幅降低背景光源繞強度小於1%，提升顯示器背景影像清晰度，並有效降低面板黃化指數小於4，減少面板色偏現象。低繞射透明顯示技術可搭配面板廠既有製程，具高可視性、高透明技術優勢，未來亦可帶動顯示器產業，鏈結智慧移動、醫療、零售及育樂等多元應用新興場域。

Based on the transparent-display integration technology for intelligent life in the future, ITRI has developed the technology with low-diffraction design in the transparent display, which could dramatically reduce the diffraction intensity smaller than 1%, improve the clarity of the display background image and effectively reduce the yellowing index of the panel smaller than 4, decrease the color-washout of the panel. The low-diffraction transparent display technology could be incorporated with the currently manufacturing process of display. In the future, we could apply this technology to various smart life applications, such as smart mobile, medical, retail and edutainment.

・降低透明顯示器黃化與繞射現象
・提升顯示器背景影像清晰度
・可維持顯示器之高透明度

・Reduce the Intensity of Diffracted Light and Yellowing index
・Improve the Clarity of the Background Image.
・Maintain the High Transparency of the Display

應用於AR智慧眼鏡之全彩micro-LED顯示器

Full-color Micro LED Display for AR Glasses

工業技術研究院

Industrial Technology Research Institute

電光系統所

解決現有光機顯示亮度限制，延伸智慧眼鏡應用至戶外

Full-color micro-LED display for AR Glasses meet the ultra-high resolution requirement so our highly efficient micro-display is exellent under outdoor environment.

應用於AR之micro-LED全彩顯示器解決現有光機顯示因亮度限制僅能在室內使用之瓶頸，使智慧眼鏡克服亮度瓶頸走出戶外，滿足當前智慧眼鏡需求。根據AR/MR終端系統的顯示器所需規格，顯示器功耗需控制在 1W 以內。對此，量測數據顯示，以功耗同為 0.75W 為例，OLED 與micro-LED亮度差距達20- 30 倍以上。

The micro-LED based full-color micro-display module is best choice for next generation AR glasses,due to the high brightness and low power. comsumption. This display can solve the problem of not being able to use outdoors due to insufficient brightness. According to the measurement data, under the same power consumption of 0.75W, the brightness difference between OLED and micro-LED is more than 20-30 times.

・量子點光色轉換
・micro-LED主動驅動
・高解析度顯示模組

1) QD converted technology
2) micro-LED AM-drive
3) High resolution display

主動驅動 mini- / micro-LED透明拼接顯示器

Transparent Tiled AM mini- / micro-LED Display Technology

工業技術研究院

Industrial Technology Research Institute

電光系統所

現行LED透明顯示器多採封裝體方式打件，畫素週期≥2mm，導致PPI提升受限而僅能用於遠距觀賞看板。工研院以mini- / micro-LED為畫素，搭配主動式TFT背板設計突破畫素限制，達成高穿透率、可拼接架構，實現首款主動驅動mini- / micro-LED透明拼接顯示器 。

ITRI developed Transparent Tiled AM mini- / micro-LED Display Technology with a seamless tiling design on TFT. Backplane which is featuring a better performance of brightness and transparency.

・超小間距、無縫拼接
・多型態化：任意型態/尺寸拼接
・高穿透度及高亮度

・Seamless tiling
・Free-size tiling
・High transparency

3D變曲率智能電化學系統設備技術

3D Intelligent Electro Chemical Machining System Technology

金屬工業研究發展中心

Metal Industries Research & Development Centre

3D變曲率智能電化學系統保留了電化學加工的優點（無應力、高效率），同時具有數控加工自由度高的優勢。使用形狀簡單的工作電極加工複雜形狀或可變曲率表面的工件，並透過演算法預測產品質量特性，準確建議加工參數。可有效減少加工次數，縮短加工時間， 提供難加工金屬與客製化生產產品的一種創新方案。

The 3D intelligent electrochemical machining system not only keeps the advantages of electrochemical machining (stress-free, high efficiency) but has the advantages of high machining freedom of NC. It uses a working electrode with a simple shape to process workpieces with complex shapes or variable curvature surfaces and uses an algorithm to predict the product quality characteristics, precisely recommending process parameters. It can effectively reduce the number of processing and reduce processing time, providing an innovative solution for difficult-to-machine metal and customized production products.

・縮短加工時間
・可加供複雜結構件
・保留傳統電化學加工優勢

透明曲面雷射3D掃描量測系統

Laser 3D Scanning Measurement System for Transparent Curved Surface

工業技術研究院

Industrial Technology Research Institute

感測系統中心

以雷射抗熱擾Specularθ深度感測技術為核心，打造透明曲面雷射3D掃描量測系統，取代現有AOI 3D量測技術所需之繁鎖程序(噴粉、檢測、清潔)，大幅縮短95%以上的量測時間(原有60分鐘縮短至1.5分鐘)，得以在產線上為品質把關

Using the thermal perturbation-resistant depth sensing technology to be the foundation of laser 3D measurement system for transparent surfaces, replace the complicated procedures (spraying、measuring and cleaning) required by the existing AOI 3D measurement technology. Significantly shorten more than 95% of the measurement time (original 60 minutes was shortened to 1.5 minutes), and can implement quality control processes on the production line.

1. 鏡面反射深度感測技術
2. 高精度3D特徵量測
3. 線上高速品質檢測

1. Specularθ Depth Sensing technology
2. High-precision 3D Geometry Analysis
3. High-speed measurement on the production line

線上晶圓級高深寬比TSV檢測技術

Development of In-line Wafer-level High Aspect Ratio TSV Inspection Technology

工業技術研究院

Industrial Technology Research Institute

量測中心

超能檢測特攻隊

OmniMeasure

採用專利準直光學設計和信號處理算法來提高 TSV 深度的分辨率，從過去數小時的檢測時間，縮短至幾秒以內，並提高測量速度。實為製造3D IC立體堆疊晶片的最佳檢測方案。

We utilize patented collimated optical designs and signal processing algorithms to enhance the resolution of TSV depth and increase measurement speed. The inspection time is reduced from hours to seconds when monitoring TSV depth. This technology is the best inspection solution for fabricating 3D IC.

【特點一】：產品提供了一種非接觸式、非破壞性和高速光學檢測解決方案
【特點二】：能檢測高達大於30 的深寬比之TSV 深度
【特點三】：幫助半導體製造商比以往更快地發現 TSV 缺陷，提高HPC 和 AI 應用的 3D-IC 的良率

【特點一】：providing a noncontact, nondestructive and high-speed optical inspection solution
【特點二】：monitoring the TSV depth with high aspect ratio up to 30
【特點三】：helping semiconductor makers find TSV defects faster than ever before and benefiting yield rate of 3D-IC for HPC and AI applications

電漿晶圓切割

Plasma Wafer Dicing

鈦昇科技股份有限公司

E&R Engineering Corporation

電漿晶圓切割可滿足即將到來的IC封裝需求，如<0.5mmx0.5mm的小晶粒、厚度薄於100um以下的功率元件、異質整合的晶粒堆疊、微機電元件。

Plasma wafer dicing can meet upcoming IC packaging demands, such as small die less than 0.5mmx0.5mm, power components thinner than 100um, heterogeneous integrated die stacking, MEMS components.

鈦昇科技可以提供整體解決方案，包括雷射開槽、保護材料和電漿蝕刻等三項。

Turn-key solution, including laser grooving, protective material and plasma etching, can be provided by E&R.

眼球追蹤解決方案

Eye Tracking Solution

見臻科技股份有限公司

Ganzin Technology

對於AR/VR頭戴式顯示器，難點在於設計和生產帶有嵌入式眼動儀的 AR/VR 頭戴式顯示器。現有的嵌入式眼動追踪解決方案包含將近20顆零組件(感測器和紅外線光源)。因此，這種眼動追踪模塊佔用了大量空間，給設備設計增加了很多限制。在見臻，我們的解決方案使用最少數量(4顆)的零組件。因此，我們的解決方案更加靈活且易於集成到新的 AR/VR 設備中。最重要的是，即使使用如此精簡的零組件，我們仍然可以達到與其他現有解決方案相同水平的眼動追踪性能。使用的元件數少於競爭對手五倍，功耗較競爭對手低3.5倍，受益於此，能大幅縮短整合的時間。

Existing embedded eye tracking solutions requires a lot of components like image sensors and infrared illuminators (around 20 components). Its cost is expensive and is difficult to integrate into HMDs. Ganzin’s solution have the simplest design which consists of only 4 components. Therefore, our solution is much more flexible and easy-to-integrate into new AR/VR devices. Most important of all, our solution can achieve similar eye tracking performance as other existing solutions.

視網膜光轉換AM-MicroLED拼接顯示器

Color-Conversion-Based Retina AM-MicroLED Tiling Display

群創光電股份有限公司

Innolux Corporation

次世代顯示技術推進室

色轉換MicroLED顯示技術藉由巨量移轉技術將藍光LED轉移至驅動基板並激發色轉換材料來達成RGB三原色，且無須邊框封裝，具備高清細膩、高色飽、絕佳環境光對比、無縫拼接四大特色。拼接單元可依使用情境由消費者在X、Y方向任意組合，自由延伸顯示屏。

Color conversion MicroLED display technology applies mass transfer technology to transfer blue LEDs to driving substrates and excite color conversion materials to achieve RGB three primary colors and without border to achieve four characteristics as below : high-definition resolution, high color saturation, excellent ambient light contrast, and seamless tiling. The tiling unit can be arbitrarily combined by consumers in the X and Y directions according to the use situation, and the display screen can be freely extended.

- 自由無縫拼接
- 絕佳環境光對比
- 沉浸式畫質體驗與NFT數位藝術展示

- Free seamless tiling
- Excellent ambient light contrast ratio
- Immersive image quality experience and NFT digital art display

毫米波陣列天線模組材料技術

Millimeter-wave array antenna module material technology.

工業技術研究院

Industrial Technology Research Institute

材化所

高穩定性、低損耗之毫米波通訊應用材料

High stability, low loss millimeter-wave communication materials.

結晶型玻璃材料配方，具有降低陶瓷材料燒結溫度的優點，同時能降低陶瓷材料損耗，解決一般共燒陶瓷損耗大的問題，適用於毫米波及更高頻段之應用。將有效改善毫米波通訊模組線路損耗問題，提升訊號品質與傳輸效率。

The formulation of crystallining glass material has the advantage of reducing the sintering temperature of ceramic materials. It also reduces the loss of ceramic materials, addressing the issue of high losses typically associated with co-fired ceramic. It is suitable for applications in millimeter-wave and higher frequency bands. It effectively improves the circuit loss issue in millimeter-wave communication modules, enhancing signal quality and transmission efficiency.

・耐溫/耐侯/隨溫度變異小
・低損耗特性可達100GHz
・3D線路疊層結構

・Temperature-resistant/weather-resistant/low temperature coefficient variation.
・Low loss characteristic up to 100GHz.
・3D circuit stacking structure.